NIPPON STEEL Chemical & Material Co., Ltd.

Molding Highly thermal conductive carbon fiber composite

Technical Classification:
[ Molding ]
Products:
[ Products / Processed Products ]
Keyword:
[ high rigidity ] [ High thermal conductivity ] [ lightweight ]

Point of the Proposed Technology

The Hybrid Carbon Fiber Reinforced Plastic Composite that takes advantages of both “High thermal conductivity”and “high elastic modulus” features of the highly thermal conductive metal foil and the pitch-based carbon fiber.

Effect(s)

High thermal conductivity, high rigidityand lightweight equivalent or superior toaluminum

Conventional Technology

New Technology

Technology Deployment and Cooperation

Development Stage
Commercialization Completed (already delivered: yes)
Intellectual Property Right
Applying
Joint Researchers (their role)
Our company's own technology
Example of Application
PC, smart phone and tablet terminal cases, or these support base materials, etc.
Technical Problems
[Technical challenge]
Knowledge on the optimal laminate composition according to the application, track record with shaped products suchas by deep drawing
Collaborator needed to Improve
Nothing in particular
Technical WEB page
https://www.nscm.nipponsteel.com/carbon/carbon.html

Inquiries

Personnel / Department
TEPreg Sales Gr. Industrial Use & TEPreg Dept. Composites Div. / Manager, Yuki Nobuzawa
Address
13-1 Nihonbashi 1-chome, Chuo-ku, Tokyo, 103-0027 Japan
Contact
TEL:+81-3-3510-0344
Inquiry Form

Outline of Company and Organization

Location
13-1 Nihonbashi 1-chome, Chuo-ku, Tokyo, 103-0027 Japan
Contact
TEL:+81-3-3510-0343
FAX:+81-3-3510-1196
Capital / No. of Employees
5,000,000,000 yen / 3,200 employees (consolidated)
Product Line
Carbon fiber composite, pitch-based carbon fiber, semiconductor electronic industrial member, metal carrier
Major Customers
Overseas Base(s)
Thailand, India, Indonesia, Philippines, Malaysia
Certification
ISO9001 (composite company)
Company/Organization WEB page
https://www.nscm.nipponsteel.com/

Update date: 2020/1/29

Back to seeds list