THERMOTEQ, Inc. (Manufucturer)  REIKEN, Inc. (Distributor)

System that performs rapid heating and rapid cooling by instantaneously switching the temperature of the medium circulating into the metal die between high and low temperature

Technical Classification:
[ Molding ]
Products:
[ Equipment / Facilities ]
Keyword:
[ cooling ] [ heating ] [ Metal die ] [ temperature control ]

Point of the Proposed Technology

・ Shortening of the molding cycle time by rapid heating and rapid cooling
・ Raising the metal die temperature during the filling to a level at which the transferability can be increased.
・ After the filling, cooling the die as rapidly as possible to achieve a high-quality molding.

Effect(s)

Increased product strength
Increased transferability
Increased gloss

New Technology

Technology Deployment and Cooperation

Development Stage Commercialization Completed (already delivered: yes)
Intellectual Property Right Yes
Joint Researchers (their role) Not disclosed
Example of Application ・Temperature control for a metal die for hot press molding
・Thick and thin plastic molding products
Technical Problems ・Survey on the necessary functions and needs for metal die temperature control systems for carbon fiber composites
Collaborator needed to Improve ・Companies that consider adopting temperature control (e.g., constant temperature, rapid heating, rapid cooling) for molding
Technical WEB pagehttp://www.thermoteq.co.jp/seihin.htm

Inquiries

Personnel / DepartmentEngineering Department / Nobuyuki Takabayashi
Address 5-2-10 Minamitsumori, Nishinari-ku, Osaka, 557-0063 Japan
Contact TEL: +81-6-6659-1347

Outline of Company and Organization

Location 5-2-10 Minamitsumori, Nishinari-ku, Osaka, 557-0063 Japan
Contact TEL: +81-6-6659-1147 FAX: +81-6-6659-1179
Capital / No. of Employees33,400,000 yen・88 employees
Product LineTemperature controllers for metal dies for plastic molding
Major CustomersNot disclosed
Overseas Base(s)Has overseas bases
CertificationISO 9001
Company/Organization WEB pagehttp://www.thermoteq.co.jp/

Update date: 2020/2/1